Recently, the Institute of Optics and Electronics, Chinese Academy of Sciences successfully completed the development of a new generation of single-field ultra-large area lithography machine (650mmX650mm). Through user acceptance, various technical indicators have reached the international advanced level.

The new generation of large-area lithography machine uses a 2500W high-power high-pressure mercury lamp as a light source, and uses an off-axis aspherical mirror combined with a fly-eye lens homogenization technology to achieve high optical power density while ensuring illumination uniformity. At the same time, in order to solve key technology issues such as leveling and alignment of large-size swatches, innovative technologies such as low-resistance air-flotation leveling technology and variable-rate optical systems have been innovatively adopted. After testing, the device has an optical power density greater than 15mW/cm2 in the 650mm x 650mm illumination area, and the illumination unevenness is ≤ 5%. The large area sample processing of 650mm x 650mm can be performed at a time, the processing resolution reaches 2μm, and the alignment accuracy is ±1μm.

The device has features such as large exposure area, high alignment accuracy, high reliability, easy operation, and high degree of automation. It can not only perform color filters (CF), spacers, and thin film transistors (TFTs) in the flat panel display industry. The processing of core components can also be applied to microelectronics, micro-electro-mechanical and micro-optics fields for micro- and nano-element processing and chip packaging of various chips, sensors, large-size gratings, encoders, and the like. At the same time, the device can also be used in the field of macroscopic processing to complete difficult machining such as thin-walled parts that are difficult to achieve with traditional machining methods, and has a wide range of applications.

Recently, the first user, the Chinese Academy of Sciences Xi’an Institute of Optics and Fine Mechanics, held an equipment acceptance meeting at the Institute of Optoelectronics. Xi'an Opto-Mechanics experts listened to the report and conducted field tests and experiments on large-area lithography machine equipment, verifying that all performance indicators met the design requirements, and expressed affirmation and appreciation for the level of research and development by the Institute of Optoelectronics.

The new generation of single-field, large-area lithography equipment is at the international advanced level in terms of core areas such as exposure area, lighting unevenness, optical power density, and alignment accuracy. Its successful development has important practical significance for improving the overall research and development level of China's micro-processing equipment and promoting the development of ultra-large-area extreme micro-machining technology in China.

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