Hard chrome plating manufacturers closely examine the issue of delamination that occurs during the plating process of printed circuit boards. This problem can significantly affect the quality and reliability of the final product. Many customers mistakenly believe that increasing the temperature and pressure after a hole is broken will improve adhesion. However, this approach is actually counterproductive. Excessive heat and pressure can cause the solvent in the resist layer to evaporate too quickly, making the dry film brittle and thin. As a result, it becomes more likely to break through the hole during development. Therefore, maintaining the flexibility and integrity of the dry film is crucial.
When holes appear during the process, it’s important to address them carefully. One key factor is exposure energy. Under ultraviolet light, the photoinitiator absorbs energy and initiates the polymerization of monomers, creating an insoluble structure in dilute alkali solutions. If the exposure is too low, the polymerization may not be complete, causing the film to swell and soften during development. This can lead to unclear lines or even total film detachment, resulting in poor adhesion to the copper surface. On the other hand, overexposure can make the film difficult to develop and may lead to peeling during electroplating. Controlling the exposure time and intensity is therefore essential for successful results.
Another critical factor is the cleaning process after copper surface treatment. Although the cleaning solution contains only mild acidic components, prolonged exposure can still negatively impact the copper surface. It's important to follow the process specifications strictly to avoid any adverse effects on the plating quality. Proper cleaning ensures that the surface remains active and ready for the next stage.
In addition, issues with gold layer adhesion on top of nickel coatings often stem from improper surface preparation. A weak surface activity of the nickel layer can prevent good bonding between the gold and the nickel. The nickel coating is also prone to forming a passive oxide layer when exposed to air. If this layer isn't properly removed before gold plating, the gold may not adhere well and could eventually peel off. Another common cause is excessive cleaning after activation, which can allow the nickel surface to re-oxidize, leading to poor adhesion and eventual delamination.
To ensure high-quality plating results, it's essential to pay attention to every step of the process—from exposure settings and cleaning times to surface treatment and plating techniques. By addressing these factors carefully, hard chrome plating manufacturers can significantly reduce the risk of delamination and improve overall product performance.
Sources:
http://news.chinawj.com.cn
Editor: Hardware Business Network Information Center
http://news.chinawj.com.cn
Coupling Nuts are internally threaded fasteners that join threaded rods, pipes, and other threaded parts, sometimes parts of differing sizes.
Metric Coupling Nut, Hex Coupling Nuts, Stainless Steel Coupling Nuts
Coupling Nut, Hex Coupling Nuts, Metric Coupling Nut, Coupler Nuts, Stainless Steel Coupling Nuts
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